Committee Members

Organizing Committee

General Chair

Kevin J. CHEN
Hong Kong University of Science and Technology

Technical Program Chair

Tom TSAI
TSMC

Short Course Chair

Shu YANG
University of Science and Technology of China

Publication Chairs

Chih-Fang HUANG
National Tsinghua University

Shu YANG
University of Science and Technology of China

Publicity Chairs

Ian CHAN
Cyntec Co., Ltd.

Tanya TRAJKOVIC
Cambridge Microelectronics, Ltd.

Sponsorship/Exhibition Chair

Ziyang GAO
Hong Kong Applied Science and Technology Research Institute (ASTRI)

Treasurer

Yansong YANG
Hong Kong University of Science and Technology

Local Arrangement

Zheyang ZHENG
Hong Kong University of Science and Technology

Veronica CHENG
Jeta HK Co. Ltd.

Advisory Committee

Gehan Amaratunga, Cambridge University (EU)
Tat-Sing Paul Chow, Rensselaer Polytechnic Institute (NA)
Mohamed Darwish, MaxPower Semiconductor (NA)
Don Disney, Infineon Technologies (NA)
Oliver Haberlen, Infineon Technologies (EU)
Dan Kinzer, Navitas Semiconductor (NA)
Leo Lorenz, ECPE, Germany (EU)
Gourab Majumdar, Mitsubishi Electric (JP)
Peter Moens, ON Semiconductor (EU)
Mutsuhiro Mori, Waseda University (JP)
Wai Tung Ng, University of Toronto (NA)
Hiromichi Ohashi, NPERC-J (JP)
Yasukazu Seki, Fuji Electric Co., Ltd. (JP)
John Shen, Simon Fraser University (NA)
Kuang Sheng, Zhejiang University (OA)
M. Ayman Shibib, Vishay Siliconix (NA)
Johnny Sin, Hong Kong Univ. of Science and Technology (OA)
Jan Šonský, InnoScience (EU)
Yoshitaka Sugawara, Ibaraki University (JP)
Richard K. Williams, Adventive Technology (NA)
Kimimori Hamada, Huawei Technologies (JP)

Technical Program Committee

Technical Program Chair

Tom TSAI, TSMC

Category 1: High Voltage Power Devices (HV)

Chair

Fred FU, Xiinergy Systems, Inc.

Members

Chiara CORVASCE, Hitachi ABB Power Grids
Shigeto HONDA, Mitsubishi Electric Corporation
Noriyuki IWAMURO, University of Tsukuba
Yi TANG, Starpower Semiconductor
Tanya TRAJKOVIĆ, CAM MuTronics
Craig FISHER, MaxPower Semiconductor
Ming QIAO, University of Electronic Science and Technology of China
Kota Oi, Fuji Electric

Category 2: Low Voltage Devices and Power IC Technology (LVT)

Chair

Tatsuya NISHIWAKI, Toshiba Electronic Devices & Storage Corporation

Members

Riccardo DEPETRO, STMicroelectronics
Hiroki FUJII, Samsung Electronics
Mark GAJDA, Nexperia
Sang-Gi LEE, DB HiTek
Amit PAUL, ON Semiconductor
Kuo-Ming WU, TSMC
Katsumi EIKYU, Renesas Electronics Corp.
Xin LIN, NXP Semiconductors

Category 3: Power IC Design (ICD)

Chair

John PIGOTT, NXP Semiconductors

Members

Bruno ALLARD, INSA (+ Ampere Lab), Lyon
Laurent CHEVALIER, STMicroelectronics
Kenji HARA, Hitachi
Xin MING, University of Electronic Science and Technology of China
Weijia ZHANG, Analog Devices
Karthik JAYARAMAN, Renesas Electronics Corp.
Makoto TAKAMIYA, The University of Tokyo
Leon WANG, Omnivision Semiconductor

Category 4: GaN and Compound Materials: Device and technology (GaN)

Chair

Tomas PALACIOS, Massachusetts Institute of Technology

Members

Oliver HILT, Ferdinand-Braun-Institut, Berlin
Sameh KHALIL, Infineon Technologies
Elison MATIOLI, EPFL
Yoshinao MIURA, AIST
Hideyuki OKITA, Panasonic
Niels POSTHUMA, IMEC
Tom TSAI, TSMC
Grace XING, Cornell University
Shu YANG, University of Science and Technology of China
Roy K.-Y. WONG, InnoScience
Hong ZHOU, Xidian University

Category 5: SiC and Other Materials (SiC)

Chair

Sei-Hyung RYU, Wolfspeed

Members

Song BAI, Nanjing Electronic Device Institute
Alexander BOLOTNIKOV, ON Semiconductor
Ulrike GROSSNER, ETH
Hiroshi KONO, Toshiba Electronic Devices & Storage Corporation
Naruhisa MIURA, Mitsubishi Electric Corporation
Dethard PETERS, Infineon Technologies
Siddarth SUNDARESAN, GeneSiC
Woongje SUNG, SUNY Polytechnic Institute
Yuichi ONOZAWA, Fuji Electric
Shinsuke HARADA, AIST
Chih-Fang HUANG, National Tsing Hua University
Cheng-Tyng YEN, Fast SiC Semiconductor Inc.

Category 6: Module and Package Technologies (PK)

Chair

Alberto CASTELLAZZI, Kyoto University of Advanced Science

Members

Wei-Chung LO, Industrial Technology Research Institute
Bassem MOUAWAD, Nottingham University
Ichiro OMURA, Kyushu Institute of Technology
Yang XU, Tesla
Emre GURPINAR, Sikorsky Innovations
Stefan OEHLING, Semikron-Danfoss
Antonio Pio CATALANO, University of Naples