Kevin J. CHEN Hong Kong University of Science and Technology
Technical Program Chair
Tom TSAI TSMC
Short Course Chair
Shu YANG Zheijiang University
Publication Chairs
Chih-Fang HUANG National Tsinghua University
Shu YANG Zhejiang University
Publicity Chairs
Ian CHAN Cyntec Co., Ltd.
Tanya TRAJKOVIC Cambridge Microelectronics, Ltd.
Sponsorship/Exhibition Chair
Ziyang GAO Hong Kong Applied Science and Technology Research Institute (ASTRI)
Treasurer
Yansong YANG Hong Kong University of Science and Technology
Local Arrangement
Zheyang ZHENG Hong Kong University of Science and Technology
Veronica CHENG Jeta HK Co. Ltd.
Technical Program Committee
Technical Program Chair
Tom TSAI, TSMC
Category 1: High Voltage Power Devices (HV)
Chair
Fred FU, Xiinergy Systems, Inc.
Members
Chiara CORVASCE, Hitachi ABB Power Grids Shigeto HONDA, Mitsubishi Electric Corporation Noriyuki IWAMURO, University of Tsukuba Yi TANG, Starpower Semiconductor Tanya TRAJKOVIĆ, CAM MuTronics Craig FISHER, MaxPower Semiconductor Ming QIAO, University of Electronic Science and Technology of China Kota Oi, Fuji Electric
Category 2: Low Voltage Devices and Power IC Technology (LVT)
Riccardo DEPETRO, STMicroelectronics Hiroki FUJII, Samsung Electronics Mark GAJDA, Nexperia Sang-Gi LEE, DB HiTek Amit PAUL, ON Semiconductor Kuo-Ming WU, TSMC Katsumi EIKYU, Renesas Electronics Corp. Xin LIN, NXP Semiconductors
Category 3: Power IC Design (ICD)
Chair
John PIGOTT, NXP Semiconductors
Members
Bruno ALLARD, INSA (+ Ampere Lab), Lyon Laurent CHEVALIER, STMicroelectronics Kenji HARA, Hitachi Xin MING, University of Electronic Science and Technology of China Weijia ZHANG, Analog Devices Karthik JAYARAMAN, Renesas Electronics Corp. Makoto TAKAMIYA, The University of Tokyo Leon WANG, Omnivision Semiconductor
Category 4: GaN and Compound Materials: Device and technology (GaN)
Chair
Tomas PALACIOS, Massachusetts Institute of Technology
Members
Oliver HILT, Ferdinand-Braun-Institut, Berlin Sameh KHALIL, Infineon Technologies Elison MATIOLI, EPFL Yoshinao MIURA, AIST Hideyuki OKITA, Panasonic Niels POSTHUMA, IMEC Tom TSAI, TSMC Grace XING, Cornell University Shu YANG, Zhejiang University Roy K.-Y. WONG, InnoScience Hong ZHOU, Xidian University
Category 5: SiC and Other Materials (SiC)
Chair
Sei-Hyung RYU, Wolfspeed
Members
Song BAI, Nanjing Electronic Device Institute Alexander BOLOTNIKOV, ON Semiconductor Ulrike GROSSNER, ETH Hiroshi KONO, Toshiba Electronic Devices & Storage Corporation Naruhisa MIURA, Mitsubishi Electric Corporation Dethard PETERS, Infineon Technologies Siddarth SUNDARESAN, GeneSiC Woongje SUNG, SUNY Polytechnic Institute Yuichi ONOZAWA, Fuji Electric Shinsuke HARADA, AIST Chih-Fang HUANG, National Tsing Hua University Cheng-Tyng YEN, Fast SiC Semiconductor Inc.
Category 6: Module and Package Technologies (PK)
Chair
Alberto CASTELLAZZI, Kyoto University of Advanced Science
Members
Wei-Chung LO, Industrial Technology Research Institute Bassem MOUAWAD, Nottingham University Ichiro OMURA, Kyushu Institute of Technology Yang XU, Tesla Emre GURPINAR, Sikorsky Innovations Stefan OEHLING, Semikron-Danfoss Antonio Pio CATALANO, University of Naples
